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Data Sheet
SMLP36 series
lAttention Points In Handlin
This product was developed as a surface mount LED especially suitable for reflow soldering.
Please take care of following points when using this device.
1.DESIGNING OF PCB
As for a recommendable solder pattern, Please refer to Fig-1.
The size and direction of the pad pattern depends on the condition of the PCB,
horough design review is recommended before the final designing.
his product of structured with rear/bottom electrode to be soldered.
The formation of solder fillet is not guaranteed due to its electrode shape
.SOLDERING Sn-Cu Sn-A -Cu Sn-A -Bi-Cu
LED products do not contain reinforcement
materials such as glass fillers.
Therefore, thermal stress by soldering greatly
influence its reliability.
The temperature conditions for reflow soldering
should therefore be set up according to the
characteristic of this product. (See Fig-2)
Number of reflow process shall be max 2 times
and these processes shall be performed in a row.
Cooling process to normal temperature shall be required
between first and second soldering process.
.HANDLING AFTER MOUNTING (Fig.-3)
As shown in the drawing on the right, in case outside force of
about 700g is given to the device, stress is concentrated to the jointed part
between mold resin and substrate.
Therefore there is a possibility to breath the device or PCB.
Careful handing is needed as ROHM cannot guarantee the falling
of the device by outside force after mounting.
.WASHING
Please note the following points when washing is required after soldering.
4-1) WASHING SOLVENT
sopropyl alcohol or other alcohol solvent is recommendable.
4-2) TEMPERATURE
Below 30篊, immersion time ; within 3 minutes.
4-3) ULTRA SONIC WASHING
Below 15/1 litter of solvent tub or less.
4-4) COOLING
Below 100篊 within 3 minutes.
0
.
4
5
0
.
2
5
0
.
2
5
0
.
4
5
0
.
4
Min.1 min Max. 40sec
Max.260篊, Within 10sec
140 to 180篊
230 to 260篊
(Fig-1)
(Fig-2)
Mask open area ratio : 80%
Mask thickness : 80 to 100mm
Reference
Substrate
Outside
Force
PCB
Mold
Soldering part
Emitting
Direction
(Fig-3)
5/6
2014.02 - Rev.G
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